How to Design a BGA? - RayPCB
raypcb.com
How to Design a BGA? - RayPCB
Introduction Ball grid array (BGA) packages have become a mainstay of modern electronics, offering high density interconnection in a small footprint. But properly laying out a printed circuit board for a BGA device does require special considerations versus other package styles. This article will provide guidance on key factors when designing ...
Feb 11, 2020
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CPU reballing is a technique used to repair or replace the solder balls that connect a CPU (Central Processing Unit) to a motherboard, particularly in devices like laptops and smartphones where the CPU is directly soldered to the board (BGA, or Ball Grid Array). This process involves removing the old solder balls, cleaning the contact points, and then applying new solder balls, often using specialized tools and techniques. It's a repair method for issues like overheating, crashing, or other faul
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