SAN FRANCISCO, CA - Flux, the AI-powered platform for hardware design, today announced $37M of new investment, including a $27M Series B led by 8VC, with participation from existing investors ...

PEACHTREE CITY, GA –February 27, 2026 – PCB Detroit will be returning to Wayne State University in June, the Printed Circuit Engineering Association ( PCEA) announced today. The conference will ...

HELSINKI – Incap Corporation reported 2025 revenue of $232 million, down 6.7% year-over-year from $248.7 million, as currency headwinds and a softer market environment weighed on results.

Atlanta — Following the Supreme Court's invalidation of IEEPA-based tariffs and implementation of new Section 122 global tariffs of 10-15%, the Electronic Components Industry Association (ECIA) is ...

WORCESTER, MA – February 26, 2026 – The Printed Circuit Engineering Association ( PCEA) today announced the debut of the PCB Management Forum at PCB East. The all-day event will be held April 28 ...

ECIA has issued a follow up Industry Alert from its Global Industry Practices Committee (GIPC) experts to update members on last Friday’s U.S. Supreme Court tariff ruling. The U.S. Supreme Court has ...

Series ultra-broadband multilayer ceramic capacitors engineered for high-speed optical communication systems operating from 7kHz to 110GHz. Series now includes 15 part numbers with new 0402 ...

AUSTIN, TX – Creative 3D Technologies (C3DT) has raised $5 million in seed funding to expand its modular “Factory-in-a-Box” manufacturing platform.

Stackpole’s new RMAN series of aluminum nitride substrate chip resistors enables greater power handling while maintaining the performance and reliability customers expect from thick film resistor ...

STOCKHOLM, SWEDEN – Note has secured a defense electronics order valued at SEK 135 million from a long-term Nordic customer for advanced printed circuit board assemblies.

Keysight Technologies introduced 3D Interconnect Designer, a software platform developed to support the design of complex interconnect structures in chiplet and three-dimensional integrated circuit ...

Molex introduced Impress Co-Packaged Copper Solutions, a compression-based connector and cable assembly designed for near-ASIC connectivity in high-speed data center systems. The solution supports ...