In our previous article on Ball Grid Arrays (BGAs), we explored how to design circuit boards and how to route the signals coming out of a BGA package. But designing a board is one thing – soldering ...

Use of surface-mount technology (SMT) in consumer products offers a major competitive advantage—they enable significant design miniaturization. Surface-mount devices (SMD) come in a variety of ...

BGA soldering is very reliable if done using the correct procedure, so we introduce GA Soldering on PCB board, BGA Inspection and BGA Rework. According to different packaging materials, BGA components ...

Tombstoning is a defect where a two-leaded, wrap-around lead-style termination chip component fails to lay down appropriately and allow solder to simultaneously make a required electrical/mechanical ...